Technical Application of High Precision Thick Film Screen Printing Machine in LTCC Multilayer Co fired Ceramics

When preparing and producing LTCC multilayer co fired ceramics, high-precision thick film screen printing equipment is required to ensure high printing accuracy and uniform film layer consistency.

Aug 30th,2024 839 Views

LTCC low-temperature co fired multilayer ceramics, as a common type of multilayer ceramic circuit board, are usually composed of a combination of ceramic and conductive materials. It's Made by co firing at low temperatures (850 ℃ -900 ℃), it has the advantages of shorter sintering time, lower processing cost, less energy, sufficient energy to produce thicker layers, high current energy, and high dimensional accuracy compared to traditional high-temperature sintering processes.LTCC multilayer ceramic plates are widely used in precision electronic components such as antennas, filters, and oscillators.

Thick film screen printing is a crucial step in the production process of LTCC. Therefore, it is necessary to use professional high-precision thick film screen printing equipment to ensure high-precision printing and film thickness consistency. JYUTEC has developed multiple models suitable for different printing areas in the LTCC field, and has mature processes and technologies. Accuracy up to ± 5um, full process digital positioning, high printing accuracy, effectively improving production capacity.

Screen printing process
1. Printing conductive layer: the conductive layer is usually printed using silver paste or copper paste. After printing, drilling and metallization are also required.
2. Printing resistance layer: the resistance layer paste is usually made of materials such as tungsten, chromium, copper, etc., to achieve the desired resistance and electrical performance. Usually, other additives such as organic resins, surfactants, acids, bases, etc. are added to the slurry of the resistance layer to improve the flowability, viscosity, stability and other properties of the slurry. After printing, drilling and metallization are also required.
3. Joint and interface parts: Use mechanical tools to drill holes, and after drilling, connect through the holes by filling the inside of the through-hole with material to achieve electrical connection. Through hole paste is usually made of metal materials with good conductivity, high temperature stability, and compatibility with LTCC materials, such as silver paste, copper paste, etc.
4. Sintering and cutting: After all printing layers are completed, sintering is required to bond the layers together. In the end, coating processing, cutting, etc. are also required. In addition, the specific sequence of printing steps may vary depending on the design of the circuit board and needs to be flexibly adjusted according to the actual situation.

Process details
Printing environment: Purification workshop, indoor temperature between 20-25 ℃, relative humidity between 40% -60%.
Printing section: conductive layer, dielectric layer, resistance layer, joint and interface section
Screen requirements: Use customized metal screen with an angle of 45 ℃ or 60 ℃ and a tension of 15-30N
Printing requirements: High precision thick film printing machine, CCD automatic alignment printing platform, and printing fixture board processed according to product specifications.
Drying and sintering: After printing, drying and sintering are required, with a drying temperature between 100 ℃ and 200 ℃ and a duration of about 10-30 minutes. The sintering temperature is between 800 ℃ and 1000 ℃, and the duration is about 1 to 3 hours.

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