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Technical application of thick film screen printing technology in New Energy Vehicle Thermal Management,JYSP
2026-10-13
As the electric vehicle (EV) market grows rapidly, demand for efficient, reliable heaters is increasing. With high reliability, uniform film thickness, high printing accuracy, and low cost, thick-film printing technology is becoming a key technology in EV thermal management systems. Its main application is in air-conditioning heaters. This article explores its use in EV air-conditioning heaters and proposes strategies for further optimization.
Technical application of thick film screen printing technology in functional ceramic metallization,JYSP
2026-10-09
Technological advances have raised performance and quality requirements for ceramic materials in modern industry, driving the development of functional ceramics—advanced materials designed to provide specific properties. Available in many types and used across a wide range of applications, functional ceramics are often combined with metals offering excellent ductility and toughness. This allows the materials to complement each other and achieve optimal overall performance.
Technical application of thick film printing technology in SOFC,JYSP
2026-09-24
SOFC (Solid Oxide Fuel Cell, also known as ceramic-based fuel cell) is a power generation device that directly converts the chemical energy of fuel into electrical energy through electrochemical reactions in a high-temperature environment. Due to its advantages of high conversion efficiency, wide fuel adaptability, and low-carbon environmental friendliness, it can be widely used in fields such as new energy vehicles, residential combined heat and power (CHP), and reverse hydrogen production.
Technical application of thick film printing technology in Ceramic Antennas,JYSP
2026-09-18
Whether we are wearing Bluetooth earphones, using navigation devices, operating drones, or driving smart cars, one key component is always behind them — the ceramic antenna. Compared with traditional PCB antennas, ceramic antennas offer advantages such as small size, high stability, strong anti-interference, and easy integration. They are widely used in various wireless communication devices. One of the key manufacturing processes behind their performance is thick film screen printing.
Technical application of thick film printing technology in Advanced Chip Applications,JYSP
2026-08-04
High‑end semiconductors have become indispensable in everyday life—often in ways we don’t notice. From personal consumer electronics and smart mobility to home automation, public infrastructure, healthcare, and entertainment, advanced chips are the silent enablers of modern convenience.
Technical application of thick film printing technology in Photovoltaic Cell Manufacturing,JYSP
2026-08-01
Against the global shift to greener, low‑carbon energy, photovoltaic (PV) power stands out as one of the most promising clean energy solutions. A PV cell combines materials science, precision engineering, and automation. Among its core processes, thick‑film screen printing is vital for electrode fabrication and conductive pattern formation. High‑precision printing equipment not only determines production throughput but also directly influences conversion efficiency and product uniformity.
Technical application of thick film printing technology in CGM dynamic blood glucose meter,JYSP
2024-12-26
CGM dynamic blood glucose monitor is an advanced diabetes management tool, which can monitor the blood glucose changes in the next 7-14 days by implanting micro sensors under the skin. The preparation of its metal electrode often results in deviations in the secondary printing position, such as curling of the substrate after printing and drying, which affects the accuracy of the electrode; The substrate itself has large errors, resulting in frequent alignment failures and other issues.
Application of high-precision thick film screen printing technology in the preparation of MLCC internal electrodes,JYSP
2024-12-04
MLCC is composed of three layers of metal layers: ceramic dielectric, inner electrode metal layer, and outer electrode. The preparation process is complex, including 13 key steps and high technical barriers. The main process flow is as follows: the slurry is cast to form a ceramic film, electrode slurry is printed on the ceramic film, then staggered stacking and co firing are carried out to form a chip, and finally external electrodes are sealed at both ends of the chip.

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Wafers
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≤400x400mm
≤600x600mm
>600x600mm
Process requirements
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