Multilayer ceramic circuit board

MLCC is composed of three layers of metal layers: ceramic dielectric, inner electrode metal layer, and outer electrode. The preparation process is complex, including 13 key steps and high technical barriers. The main process flow is as follows: the slurry is cast to form a ceramic film, electrode slurry is printed on the ceramic film, then staggered stacking and co firing are carried out to form a chip, and finally external electrodes are sealed at both ends of the chip.

In the preparation process of multi-layer ceramic circuit boards, through-hole wall hanging/hole filling buried hole printing is a key step in achieving circuit interconnection.

When preparing and producing LTCC multilayer co fired ceramics, high-precision thick film screen printing equipment is required to ensure high printing accuracy and uniform film layer consistency.

High precision thick film printing process for conductive and insulating ceramic sealing components used in electronic components