In the preparation process of multi-layer ceramic circuit boards, through-hole wall hanging/hole filling buried hole printing is a key step in achieving circuit interconnection.
In the preparation process of multi-layer ceramic circuit boards, through-hole wall hanging/hole filling buried hole printing is a key step in achieving circuit interconnection. These processes require the slurry to be evenly distributed within the pores to ensure the stability and reliability of the circuit. This article will focus on the application of high-precision thick film printing technology in this field.
Technical Background and Requirements
1. Through hole wall hanging processPrinting the slurry onto the inner walls of holes in raw and hard porcelain substrates using inclined or vertical scrapers, with uniform and crack free slurry on the inner walls.2. Hole filling and burying processPrint the slurry evenly throughout the entire hole, ensuring that the slurry inside the hole is full and uniform, and there is no slurry thrown out from the outer ring of the hole.
The advantages of high-precision thick film printing technology
The filling and burying processes include screen printing, electroplating filling, laser filling, chemical deposition filling, etc. The through-hole hanging process includes screen printing, spraying, manual brush coating, etc; High precision screen printing technology, as a low-cost, stable, and efficient printing method, is widely used in wall hanging/hole filling processes. However, due to the high requirements for printing accuracy and uniformity, ordinary screen printing machines cannot meet the printing requirements. The high-precision thick film screen printing machine HG-250-LTCC shown below is suitable for hole filling and burying processes.
Filling and burying thick film printing machine
(High precision thick film printing machine HG-250-LTCC)
The high-precision thick film screen printing machine IC-250B-CCD shown below is suitable for wall hanging technology and can also customize fixtures according to the product's appearance.1. High precision printing: using a suspension printing system, minimum printing pressure: ± 0.01kg, high printing accuracy.2. Precise structure: Adopting precise mechanical design improves the accuracy and repeatability of printing.3. CCD alignment system: Equipped with advanced CCD alignment system, it can quickly identify substrate placement deviation within 0.3 seconds and perform automatic correction to ensure the accuracy of printing position.4. Specialized pore filling platform: with micron sized pore size, it effectively avoids leaving adsorption marks on the back of the product, with high adsorption rate and good pore filling effect.5. Multi functional printing: The equipment can adapt to filling holes in products with aperture sizes ranging from 0.15mm to 0.45mm.
(Jyutec Customer Hole Filling Printing Sample Report)
Through-hole wall mounted thick film printing machine
(High precision thick film printing machine IC-250B-CCD)
The high-precision thick film screen printing machine IC-250B-CCD shown below is suitable for wall hanging technology and can also customize fixtures according to the product's appearance.1. High precision printing: using a suspension printing system, minimum printing pressure: ± 0.01kg, high printing accuracy.2. The left and right running platform structure is easy to operate and observe, and the printing is efficient and stable.3. CCD alignment system: Equipped with advanced CCD alignment system, it can quickly identify substrate placement deviation within 0.3 seconds and perform automatic correction to ensure the accuracy of printing position.4. Wall mounted dedicated platform: adopting a hollow body design to ensure uniform and stable vacuum in the adsorption area of through holes, wall mounting, and printing operations.5. Multi functional printing: The equipment can adapt to wall hanging products with apertures ranging from 0.3mm to 3mm.
High precision thick film printing technology has played an important role in through-hole hanging/filling and burying processes due to its advantages of high precision, high stability, and high efficiency. With the continuous development of microelectronics manufacturing and ceramic packaging, the requirements for printing technology will become increasingly high. In the future, high-precision thick film printing technology will continue to undergo technological innovation and optimization to meet a wider range of application needs.
