Semiconductor

Thick Film Printing Technology for Glass Powder Coating on Semiconductor Wafers,JYSP
2023-08-07
Thick film screen printing technology is widely used in semiconductor production, which can be applied to multiple semiconductor production processes such as round crystal coated glass powder, photoresist printing, soldering printing in semiconductor packaging processes

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Ceramics
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≤150x150mm
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Your Name*
Email*
Printing Materials
Choose your substrate material
Ceramics
Metals
Thin Films
Wafers
Glass
Other Materials
Printing Area*
Choose your products printing area
≤150x150mm
≤250x250mm
≤400x400mm
≤600x600mm
>600x600mm
Process requirements